IEEE FLEPS 2024 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
We live in exciting times where new technology convergences are emerging. The evolution of electronic technology amalgamates with emerging applications of IoT, machine learning, precision medicine, and wearables. Underlying these verticals are exciting innovations in material, devices and, systems at different scales and levels.
Speaker will elaborate what are Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) and introduce Picosun products for these deposition technologies. ALD has become an essential method for virtually all semiconductor component manufacturing, but also for other applications such as displays or similar. ALD, for instance, enables superior protective barrier coating for organic materials in OLED displays or in organic electronics which is a necessity to retain their operational lifetime. MLD, on the other hand, is not as mature as ALD or chemical vapor deposition (CVD) and rarely seen in industrial applications today, but it has clear advantages especially for flexible electronics applications. Picosun has served markets also outside of the traditional semiconductor genre and examples of different Picosun solutions for industrial scale Flexible Electronics will be presented.
In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF electronics, RFIDs microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules and Metasurfaces for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will touch up the state- of-the-art area of fully-integrated printable FHE-Enabled broadband wireless modules covering characterization of 3D printed materials up to E-band, novel printable “ramp” interconnects and cavities for IC embedding as well as printable structures for self-monitoring and anti-counterfeiting packages.
