Organizing Committee

Meet the Organizing Committee of IEEE FLEPS 2024: a team of esteemed professionals leading the forefront of flexible and printable electronics.

General Co-Chairs

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    Matti Mäntysalo

    Tampere University, Finland

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    Gaetano Marrocco

    University of Roma Tor Vergata, Italy

Technical Program Co-Chairs

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    Shweta Agarwala

    Aarhus University, Denmark

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    National University of Singapore, Singapore

Oversight Committee

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    Ravinder Dahiya

    Northeastern University, Boston, USA

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    Kourosh Kalantar-Zadeh

    University of Sydney, Australia

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    Paolo Lugli

    University of Bozen, Italy

Industry Co-Chairs

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    Emre Ozer

    Pragmatic Semiconductor, UK

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    Jukka Hast

    VTT, Finland

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    Antonio Facchetti

    Georgia Tech., USA

Conference Treasurer

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    Srinivas Tadigadapa

    Northeastern University, Boston, USA

Tutorial/Workshop Co-Chairs

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    Nanshu Lu

    University of Texas, Austin, USA

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    Mario Lanza

    KAUST, Saudi Arabia

Focused Session Co-Chairs

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    KAIST, South Korea

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    Tina Ng

    UCSD, USA

Awards Co-Chairs

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    Vincenzo Vinciguerra

    STMicroelectronics, Italy

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    Dimitra Georgiadou

    University of Southampton, UK

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    Sahika Inal

    KAUST, Saudi Arabia

Publicity Co-Chairs

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    Sayni Majumdar

    Tampere University, Finland

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    Yuqing Zheng

    Peking University, China

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    Joseph Andrews

    University of Wisconsin - Madison, USA

Diversity/WiSe Co-Chairs

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    Radio6ense SRL, Italy

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    Shawana Tabassum

    The University of Texas at Tyler, USA

Young Professional Co-Chairs

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    Gerd Grau

    York University, Canada

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    Mitradip Bhattacharjee

    Indian Institute of Science Education and Research, Bhopal, India

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    Oliver Ozioko

    University of Derby, UK

Publications Co-Chairs

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    Ravinder Dahiya

    Northeastern University, Boston, USA

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    Thilo Sauter

    TU Wien and Danube University Krems, Austria

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    Wei Gao

    CALTECH, USA

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    Luigi G. Occhipinti

    Cambridge University, UK