General Co-Chairs
Matti MäntysaloTampere University, Finland
Gaetano MarroccoUniversity of Roma Tor Vergata, Italy
Meet the Organizing Committee of IEEE FLEPS 2024: a team of esteemed professionals leading the forefront of flexible and printable electronics.

Tampere University, Finland

University of Roma Tor Vergata, Italy

Aarhus University, Denmark

National University of Singapore, Singapore

Northeastern University, Boston, USA

University of Sydney, Australia

University of Bozen, Italy

Pragmatic Semiconductor, UK

VTT, Finland

Georgia Tech., USA

Northeastern University, Boston, USA

University of Texas, Austin, USA

KAUST, Saudi Arabia

KAIST, South Korea

UCSD, USA

STMicroelectronics, Italy

University of Southampton, UK

KAUST, Saudi Arabia

Tampere University, Finland

Peking University, China

University of Wisconsin - Madison, USA

Radio6ense SRL, Italy

The University of Texas at Tyler, USA

York University, Canada

Indian Institute of Science Education and Research, Bhopal, India

University of Derby, UK

Northeastern University, Boston, USA

TU Wien and Danube University Krems, Austria

CALTECH, USA

Cambridge University, UK